Etching process is a process that we are all familiar with. It is involved in many industries. So what are the issues that need to be paid attention to during the construction of etching process? The following editor will introduce to you what are the issues that need to be paid attention to in the etching process.

1. What we need to do is to improve the consistency of etching efficiency between boards.

If we want to achieve this requirement, we must ensure that the etching solution is always in the best etching state during the entire etching process. This requires us to choose an etching solution that is easy to regenerate and compensate, and the etching rate is easy to control.

Choose processes and equipment that can provide constant operating conditions and automatically control various solution parameters. This is achieved by controlling the amount of dissolved brass etching, pH value, solution concentration, temperature, and uniformity of solution flow.

2. It is also necessary to improve the uniformity of the etching process rate of the entire board surface. The etching uniformity of the upper and lower sides of the board and various parts of the board surface is determined by the uniformity of the etching agent flow on the board surface. During the etching process, the etching rates of the upper and lower board surfaces are often inconsistent.

– Generally speaking, the etching rate of the lower board surface is higher than that of the upper board surface. Because there is solution accumulation on the upper board surface, the etching reaction is weakened. The uneven etching of the upper and lower boards can be solved by adjusting the spray pressure of the upper and lower nozzles.

A common problem in etching printed circuit boards is that it is difficult to etch the entire board surface cleanly at the same time. The edge of the board is aluminum and titanium etched faster than the center of the board. Using a spray system and swinging the nozzle is an effective measure. Further improvement can be achieved by making the spray pressure at the center and edge of the board different, and intermittently etching the front and back ends of the board to achieve uniform etching of the entire board surface.